TECHNICAL CERAMICS - PRECISION MACHINING WITH INNOVATIVE TECHNOLOGY AT LILA
With over 20 years of experience in processing technical ceramics, LILA is one of the technology leaders in this field. Our expertise and innovative processes enable the precise and economical processing of even the most challenging workpieces.
Whether in electronics, energy and environmental technology, in machine, plant, vehicle and equipment construction or in medical technology - technical ceramics have established themselves as an indispensable material. Their unique mechanical, thermal, electrical and biological-chemical properties are constantly opening up new fields of application.
Qualities of ceramic processing with LILA
- Ultra-narrow kerfs: Cutting widths from 0.05 mm for the finest details.
- Slots with high aspect ratio:
* Up to 20:1 for micro-drilling
* Up to 400:1 for micro-cutting - Perfectly vertical cutting surfaces: For maximum dimensional accuracy.
- Extremely small hole diameters: From 0.25 mm.
Fields of application and industries
The machining of technical ceramics at LILA is used in a wide range of industries:
- Electronics industry: Precise machining for silicon wafers and microtechnical components.
- Medical technology: Production of complex components with high biocompatibility requirements.
- Mechanical and plant engineering: Resistant components with complex geometries.
- Energy and environmental technology: Solutions for durable, corrosion-resistant components.
The combination of many years of experience, state-of-the-art technology and a high degree of precision makes LILA a reliable partner for processing technical ceramics. We are flexible when it comes to batch sizes and manufacture samples, prototypes and small and large series for you.
Innovative technology: water jet-guided laser processing
LILA relies on state-of-the-art water jet-guided laser technology, which makes it possible to precisely cut and drill a wide variety of materials made of technical ceramics such as silicon, silicon carbide, silicon nitride, aluminum nitride, boron nitride, boron carbide and tungsten carbide. We use this technology to process material thicknesses from 0.1 mm to 27 mm, whereby we are leaders in the field of thick ceramics in particular, such as silicon nitride.
Our water jet-guided laser technology is particularly suitable for silicon wafer production, as it enables maximum precision with minimal thermal and mechanical stress on the material. Even complex and delicate workpieces made of technical ceramics, which are difficult or impossible to process using conventional methods, can be cut or drilled using our technology.
Advantages of waterjet-guided laser technology from LILA
- High-quality cutting surfaces without burrs: perfect cutting quality without reworking.
- Parallel cuts without heat-affected zone (HAZ): No thermal damage to the material.
- Process force-free machining: Gentle on the workpiece, even with delicate structures.
- Precision to perfection: Suitable for complex and intricate geometries.
